Powder magnetron sputtering coater is a kind of equipment used to deposit thin film on the surface of the substrate, using the magnetron sputtering technology to convert the powdery target into a film covering the substrate.
The working principle of powder magnetron sputtering coater is mainly based on magnetron sputtering technology. The specific steps are as follows:
Target preparation:
The target material exists in powder form and is usually made of metals, alloys, ceramics and other materials. These powder targets are loaded into the target platform and serve as the sputtering source.
Vacuum environment:
The coating process is carried out in a vacuum chamber to reduce the interference of gas molecules on sputtered particles and ensure the stability of the deposition process and the quality of the film.
Plasma generation:
An inert gas (such as argon) is introduced into the vacuum chamber and a high voltage electric field is applied to produce a plasma. High-energy ions in the plasma, such as argon ions, accelerate and bombard the surface of the target under the action of an electric field.
Sputtering process:
High-energy argon ions bombard the surface of the powder target, causing the target atoms or molecules to sputter from the surface. These sputtered particles move freely in the vacuum and eventually deposit on the surface of the substrate to form a uniform film.
Magnetic enhancement:
The magnetic field and electric field produced by the magnetron work together to make the electrons form a rotating motion near the surface of the target, which greatly increases the ion bombardment density on the surface of the target and improves the sputtering efficiency.
Film formation:
The sputtered target particles are deposited on the surface of the substrate and gradually form the desired film. The thickness and composition of the film can be controlled by controlling the sputtering time, the type and concentration of the target powder.
Powder magnetron sputtering coater is widely used in the following fields:
Semiconductor manufacturing: Used to deposit various functional films, such as conductive layer, insulating layer, barrier layer, etc., is a key process step in semiconductor device manufacturing.
Optical device: Coating the optical element to form an anti-reflection layer, a filter layer or a reflector layer to improve optical performance.
Protective coatings: wear-resistant coatings are deposited on tools or mechanical parts to increase surface hardness and corrosion resistance and extend service life.
Decorative coating: Used for the deposition of decorative coatings to change the color, luster or texture of the surface of objects, widely used in jewelry, watches and other fields.
Energy field: Used to manufacture transparent conductive oxide (such as ITO) films in solar cells, and to deposit functional layers in energy storage devices.
Biomedical devices: Functional treatment applied to the surface of biomedical devices, such as deposition of a coating or biocompatible coating on an implant.
The advantages of powder magnetron sputtering coaters are their compatibility with a wide variety of materials and their ability to control the uniformity and composition of the film, making them indispensable tools in the industrial and scientific fields.