There is a heating element in the cavity, which can be used to bake the glue after homogenizing the glue. The product has a gas path controlled by two float flowmeters, which can pass inert gas into the chamber and protect the glue liquid from the gas in the air when the glue is homogenized. This homogenizer is suitable for surface coating of semiconductor wafer, slide, wafer, substrate, ITO conductive glass and other processes and plate making. The maximum wafer size is 6 inches, the speed can reach 10000rpm, and the acceleration can reach 5000rpm. It has the advantages of stable speed, quick start, easy operation, etc., and can ensure the consistency and uniformity of the thickness of the uniform glue. It is a product with excellent performance.

Product Characteristics

1. Adopt DC brushless motor, MCU control

2. High-definition touch screen control

3. Can carry out single-step multi-step glue operation, can store five kinds of programs, each program can set five steps of operation

4. Anti-blocking adhesive design

5. Aluminum alloy cavity, durable

6. With ultrasonic, atmosphere, heating and other auxiliary functions, for a variety of auxiliary glue research