The ultrasonic atmosphere heating homogenizer is a flexible rotating homogenizer with a diameter of 300mm, which can spray the glue liquid on the substrate through the ultrasonic nozzle, and then make the glue liquid evenly coated on the substrate through high-speed rotation. Spin coating can also be performed alone. There is a heating element in the cavity, which can be used to bake the glue after homogenizing the glue. The product has a gas path controlled by two float flowmeters, which can pass inert gas into the chamber and protect the glue liquid from the gas in the air when the glue is homogenized. 

This spin coater is suitable for surface coating of semiconductor wafer, slide, wafer, substrate, ITO conductive glass and other processes and plate making. The maximum wafer size is 12 inches, the speed can reach 3000rpm, and the acceleration can reach 2000rpm. It has the advantages of stable speed, quick start, easy operation, etc., and can ensure the consistency and uniformity of the thickness of the uniform glue. It is a product with excellent performance.